The Intel 4 process achieves 20% better performance and scales logic density by 2X while reducing costs through extensive design co-optimization, adoption of new materials, and judicious use of EUV lithography. The first product, the Meteor Lake compute tile, will ramp to high volume manufacturing in 2023. The post Intel 4 Process Scales Logic...
Transistor count and transistor density are often portrayed as technical achievements and milestones. Many vendors brag about the complexity of their design, as measured by transistor count. In reality, transistor count and density varies considerably based on the type of chip and especially the type of circuitry within the chip, and there is no...
Power delivery is one of the most significant challenges in modern processors. The power delivery network (PDN) must meet the demanding requirements of modern CMOS technology, supply power with excellent efficiency, and swiftly respond to changes in power draw. The post Power Delivery in a Modern Processor appeared first on Real World Tech.
For me, SC19 was about the fusion of machine learning and scientific computing. I learned about new technologies from Nvidia, Graphcore, and Cerebras Systems and spoke on a panel about the role of MLPerf in benchmarking HPC systems for machine learning and the many lessons learned. The post SuperComputing 19: HPC Meets Machine Learning appeared...
At VLSI 2018, researchers from TDK and TSMC described advances in Magneto-resistive memory (MRAM). TDK focused on new materials to improve writing for low-voltage MRAM cells at small geometries. A team from TSMC showcased circuit techniques to improve read performance of MRAM arrays despite process variability and a small read window. The post...
IBM presented a neural network accelerator at VLSI 2018 showcasing a variety of architectural techniques for machine learning, including a regular 2D array of small processing elements optimized for dataflow computation, reduced precision arithmetic, and explicitly addressed memories. The post IBM’s Machine Learning Accelerator at VLSI 2018...
Intel will offer 3DXP-based DIMMs (previously codenamed Apache Pass) that use the DDR4 interface on the next-generation Cascade Lake server processor. The first DIMMs will be available in 128GB, 256GB, and 512GB capacities and work with a new software architecture for persistent memory. Intel and its partners have enabled the new persistent...
Intel's 22FFL (FinFET Low-power) is a variant of their existing 22nm process that is aimed at low-cost, extremely low-power, and analog/RF applications. 22FFL relaxes the ground rules to reduce the need for double patterning, thereby cutting costs. At the same time, Intel’s engineers essentially backported the second and third generation FinFETs...
Previously, Apple’s iPhones and iPads used PowerVR GPUs from Imagination Technologies for graphics. Based on our analysis, Apple has created a custom GPU that powers the A8, A9, and 10 processors, shipping in the iPhone 6 and later models, and some iPads. Using public documents, we demonstrate that the programmable shader cores inside Apple’s GPU...
Starting with the Maxwell GM20x architecture, Nvidia high-performance GPUs have borrowed techniques from low-power mobile graphics architectures. Specifically, Maxwell and Pascal use tile-based immediate-mode rasterizers that buffer pixel output, instead of conventional full-screen immediate-mode rasterizers. Using simple DirectX shaders, we...